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Micrometer wire of diamond 310-350 (silicon wafer cutting and root)

date:2015-06-23 13:25  hits:  size【big | normal | small

1. Diamond is well- packaged; sharpness is good.
2. Cutting speed is fast, capacity is high with low cost.
3. Advanced and stable technique with high precision of cutting.
4. Low cost of operation.
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